After checking the Physical Dimensions, Real-time X-ray and shadowgraph X-rays are performed to observe evidence of counterfeiting by analyzing the die size and wire bonding and to uncover any possible delaminations.
Internal Visual Verification
Component samples are delidded, and an internal inspection is made. The die is checked for defects, and the manufacturer’s logo on the die must match that on the lid of the component. The die topography also is analyzed to see if it meets the outline of the manufacturer’s requirements.
The component is placed under a high-powered microscope and verified against the manufacturer’s specifications. Photographs of this process are taken each step of the way. In the event of insufficient verification data, engineer-ing consultation will refer to other methodologies in the process to uncover counterfeit or cloned devices.