Material Analysis

A four-point inspection of the device die, leads, bond wire, and packaging is performed to verify material authenticity. The following tests are conducted separately or together:

Scanning Electron Microscopy
SEM analysis uses a focused beam of high-energy electrons to generate a variety of signals at the surface of the specimens. The signals that derive from electron-sample interactions reveal information about the sample including external morphology, chemical composition, crystalline structure, and orientation of materials that make up the sample to see if these structures meet the manufacturer’s requirements.  The following figures show the differences between an original and a counterfeit.

Materials Analysis Graphs of an Original and Cloned Component
Materials Analysis Graphs of an Original and Cloned Component

Energy-Dispersive X-Ray Spectroscopy
EDXRS is an analytical technique used for elemental analysis or chemical characterization to see if the elements are verified in accordance with the manufacturer’s requirements.

Fourier Transform Infrared Spectroscopy
FTIR spectroscopy is used mostly for identifying chemicals that are either organic or inorganic, especially for indi-cating polymer, coatings, and contaminants that help identify counterfeit electronic products.

Energy-Dispersive X-Ray Fluorescence
Energy-dispersive XRF is performed to characterize individual particles to verify they meet manufacturing criteria both quantitatively and qualitatively.

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Author: josephfedericonj

Joseph Federico is Vice President and Director of Operations for NJ MET, Inc., located in Clifton, NJ. He speaks world-wide on current issues in Electronic Component Testing. Among his responsibilities at NJMET, Inc. is heading up its charity programs.

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