NJMET Announces Collaboration with BGA Test and Technology

Late last month, NJMET announced a new collaboration with BGA Test and Technology of Bohemia, NY. The collaboration will provide our customers with a larger array of services by combining the finishing services of BGA Technology with NJMET’s screening, qualification, re-ceritfication and testing programs.

BGA offers finishing services in the following areas: Solder Ball Attach, Reball and Repair, Pb to Pb free Conversion, PB free to PB conversion, Lead Conditioning (Repair) and PCB Device Reclaim.

See the full press release for more details.  Please check the NJMET website for information on all of our test and engineering services, including the Mission Imposter Risk Mitigation program.

Please contact me at joef@njmet.com or 973 546-5393 for more information on this new collaboration or any other NJMET service.


Author: josephfedericonj

Joseph Federico is Vice President and Director of Operations for NJ MET, Inc., located in Clifton, NJ. He speaks world-wide on current issues in Electronic Component Testing. Among his responsibilities at NJMET, Inc. is heading up its charity programs.

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